General
Device type
Solid State Drive - internal
Interface
PCIe 3.0 x4 (NVMe)
Features
Temperature sensor, shock resistant, TRIM support, end-to-end data path protection, optimal data flow, 3D NAND technology, global wear leveling, SLC cache, ECC recovery LDPC, NVM Express (NVMe) deallocate support, L1.2 Power-saving mode, HMB (Host Memory Buffer) support, NVM Express (NVMe) 1.4, NVMe Security Erase support, MEDS (Mushkin Enhanced Data-protection Suite), InnoGrit IG5216, S.M.A.R.T.
Performance
Internal data throughput
3300 MBps (read) / 2900 MBps (write)
Positioning time
0.1 ms (average)
Reliability
Expansion and connectivity
Interfaces
1 x PCI Express 3.0 x4 (NVMe) - M.2 Card
Compatible switch field
M.2 2280
Power Supply
Power Consumption
0.3 watts (idle)
3 watts (active)
Miscellaneous
Manufacturer's warranty
Service and support
Limited warranty - 3 years
Environmental conditions
Min. operating temperature
0 °C
Max. operating temperature
70 °C
Min. storage temperature
-40°C
Max. storage temperature
85 °C
Shock tolerance (during operation)
1500 g
Product safety information
Manufacturer information:
Mushkin Logistik GmbH
Barthelsmühlring 6
Baden-Württemberg
Kandel, Deutschland, 76870
info@mushkin.de
https://www.mushkin.de/
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