General
Memory
Module Height (inch)
1.23
Speed
2666 MHz (PC4-21300)
Latency Timings
CL19 (19-19-19)
Features
Dual rank, eight banks, On-Die Termination (ODT), Micron F-Die chips, unbuffered
Module Configuration
4096 x 72
Chips Organization
2048 x 8
Miscellaneous
Compliant Standards
RoHS, halogen-free, JEDEC
Manufacturer Warranty
Service & Support
Limited lifetime warranty
Product safety information
Manufacturer information:
Kingston Technology Deutschland GmbH
Leonrodstraße 56
München, Deutschland, 80636
info@kingston.de
www.kingston.com/de
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