General
Product type
Air cooler for processors
Package contents
Dow Corning TC-5121 thermal compound, heat spreader
Heat sink and fan
Compatible with
LGA1150 Socket, LGA1151 Socket, LGA1155 Socket, LGA1156 Socket, LGA1366 Socket, LGA2011-3 (Square ILM) Socket, LGA2066 Socket, LGA775 Socket, Socket AM2, Socket AM2+, Socket AM3+, Socket AM4, Socket FM1, Socket FM2, Socket FM2+
Cooler material
Aluminum and copper
Heatsink Dimensions
135.2 mm x 65 mm x 160 mm
Fan bearing
Twister Bearing
Rotation speed
500-1,000 rpm
Airflow
50.59 - 55.45 m³/h (29.78 - 94.21 CFM)
Air pressure
0.57-2.13 mm
Power connection
Fan connection, 4-pole
Features
5 copper heat pipes (6 mm), Thermal Conductive Coating (TCC)
Various
Product safety information
Manufacturer information:
Enermax Europe GmbH
Billbrookdeich 32
Hamburg
Hamburg, Deutschland, 22113
marketing@enermax.de
https://www.enermaxeu.com/de/
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German
Italian
