General
Product type
Air cooler for processors
Package contents
Thermal compound TC-5121C Dow Corning
Heat sink and fan
Compatible with
LGA1150 socket, LGA1151 socket, LGA1155 socket, LGA1156 socket, LGA1366 socket, LGA2066 socket, Socket AM2, Socket AM2+, Socket AM3, Socket AM3+, Socket AM4, Socket FM1, Socket FM2, Socket FM2+, LGA2011-3 socket, LGA2011 socket
Cooler material
Aluminum and copper
Heatsink Dimensions
135.2 mm x 65 mm x 160 mm
Fan bearing
Twister Bearing
Rotation speed
500-1,600 rpm
Airflow
40.45 - 121.17 m³/h (23.81 - 71.32 CFM)
Air pressure
0.673-3,07 mm
Power connection
Fan connection, 4-pole
Features
5 copper heat pipes (6 mm), Thermal Conductive Coating (TCC), addressable RGB LED, RGB Fusion 2.0, RGB Sync Ready, 16.8 million colors, PWM support (Pulse-Width Modulation), Air-Guide technology, PDF (Pressure Differential Flow) design, Vortex Generator Flow (VGF) technology, Vacuum Effect (VEF) technology, Heat-pipe Direct Touch (H.D.T.) Technology, ARGB fans
Miscellaneous
Product safety information
Manufacturer information:
Enermax Europe GmbH
Billbrookdeich 32
Hamburg
Hamburg, Deutschland, 22113
marketing@enermax.de
https://www.enermaxeu.com/de/
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